PCB Assembly Capability | ||||
Item | Lot Size | |||
Normal | Special | |||
PCB(used for SMT)spec | (L*W) | Min | L≥3mm | L＜2mm |
W≥3mm | ||||
Max | L≤1200mm | L ＞ 1200mm | ||
W≤500mm | W＞ 500mm | |||
(T) | Min thickness | 0.2mm | T＜0.1mm | |
Max thickness | 4.5mm | T＞4.5mm | ||
SMT components spec | outline dimension | Min size | 201 | 1005 |
(0.6mm*0.3mm) | （0.3mm*0.2mm) | |||
Max size | 200mm*125mm | 200mm*125mm＜SMD | ||
component thickness | T≤6.5mm | 6.5mm＜T≤15mm | ||
QFP、SOP、SOJ(multi pins) | Min pin space | 0.4mm | 0.3mm≤Pitch＜0.4mm | |
CSP,BGA | Min ball space | 0.5mm | 0.3mm≤Pitch＜0.5mm | |
DIP PCB SPEC | (L*W) | Min Size | L≥50mm | L＜50mm |
W≥30mm | ||||
Max Size | L≤1200mm | L≥1200mm | ||
W≤500mm | W≥500mm | |||
(T) | Minimum Thickness | 0.8mm | T＜0.8mm | |
Maximum Thickness | 2mm | T＞2mm | ||
BOX BULID | FIRMWARE | Provide programming firmware files,Firmware + software installation instructions | ||
Function test | Level of testing required along with test instructions | |||
Plastic & Metal Casings | Metal Casting,Sheet Metal work,Metal Fabrication,Metal Fabrication,Metal and plastic extrusion | |||
BOX BUILD | 3D CAD model of enclosure + specifications (include drawings, size, weight, colour, material, finish, IP rating, etc) | |||
PCBA FILES | PCB FILE | PCB Altium/Gerber/Eagle files (Including specs such as thickness, copper thickness, solder mask colour, finish, etc) | ||
